Hāʻawi mākou i ka mea hoʻohui Wafer / Wire to Board me nā pitch like ʻole a me nā ʻano media no nā mea kūʻai aku ma ka honua holoʻokoʻa.
Hoʻohana nui ʻia nā huahana ma nā kamepiula a me nā huahana peripheral, nā huahana uila uila, nā huahana uila kamaʻilio, nā huahana uila kaʻa, nā huahana uila waihona panakō, nā huahana uila a me nā huahana uila home, etc.
Kūlike mākou me ka ISO9001/ISOI14001 ʻōnaehana hoʻokele waiwai no ka hoʻokele maikaʻi. Ke manaʻo nei mākou e lilo i hoa pili lōʻihi ma Kina.
HuahanaHōʻike:
mea hoʻopololei | Lcp UL94V-0 |
Hoʻopili ʻia o ka mea hoʻohui | Bronze Phosphor, Tin/Gula Ma ka huelo kūʻai |
Pili honua | Phonsphor Bronze |
Voltage Hana | 200V AC / minuke |
Ka helu o kēia manawa | 0.5A |
Ka Mahana Hana | -25–+85 degere |
Kūleʻa hoʻokaʻawale | ≧100MΩ |
Palapala noi | kamepiula, kamepiula kamepiula; heluhelu kāleka |
Ka nui packing maʻamau | 1000 pcs |
MOQ | 1000 pcs |
Ka manawa o waena o ka hoʻomaka a i ka wā pau | 2 pule |
Nā pōmaikaʻi o ka ʻoihana:
● He mea hana mākou, me nā makahiki 20 o ka ʻike ma ke kahua hoʻohui uila, aia ma kahi o 500 mau limahana i kā mākou hale hana i kēia manawa.
● Mai ka hoʻolālāʻana i nā huahana,–mea paahana– Injection – Punching – Plating – Assembly – QC Inspection-Packing – Hoʻouna, hoʻopau mākou i nā kaʻina hana a pau i loko o kā mākou hale hana koe wale nō ka plating .No laila hiki iā mākou ke hoʻomalu maikaʻi i ka maikaʻi o nā mea.
● Pane wikiwiki. Mai ke kanaka kūʻai aku i QC a me R&D engineer, inā pilikia nā mea kūʻai aku, hiki iā mākou ke pane i ka mea kūʻai aku i ka manawa mua.
● Nā ʻano huahana like ʻole: Nā mea hoʻohui kāleka/ Nā mea hoʻohui FPC / nā mea hoʻohui USB / nā uea i nā mea hoʻohui papa / nā mea hoʻopili papa / nā mea hoʻohui hdmi / nā mea hoʻohui rf / nā mea hoʻohui bateria ...
Hoʻopili kikoʻī: Hoʻopiha ʻia nā huahana me ka reel & tape packing, me ka pahu pahu, ʻo waho ka pahu i loko o nā pahu pahu.
Nā kikoʻī hoʻouna: Koho mākou i nā hui moku lawe honua DHL / UPS / FEDEX / TNT e hoʻouna i nā waiwai.